• DocumentCode
    2475461
  • Title

    Packaging high-power diode laser bars using microchanneled copper mounts

  • Author

    Loosen, Peter ; Ebert, Thomas ; Jandeleit, Jürgen ; Treusch, Georg

  • Author_Institution
    Fraunhofer-Inst. fur Mikrostrukturtech., Berlin, Germany
  • Volume
    2
  • fYear
    1998
  • fDate
    3-4 Dec 1998
  • Firstpage
    434
  • Abstract
    High-power diode lasers with an average output power of several 10 W and above are growing into key components for modern laser systems and applications in, e.g. materials processing and medicine. Solid state lasers strongly benefit from the higher laser beam quality, lifetime and reliability as well as from the lower energy consumption and floor space requirement which are possible if diode lasers are used instead of conventional lamps. In diode lasers for direct applications in, e.g. soldering and plastics welding most of these advantages even become more evident
  • Keywords
    laser applications in medicine; laser beams; laser materials processing; laser reliability; packaging; semiconductor lasers; 10 W; Cu; average output power; high-power diode laser bar packaging; key components; laser beam quality; laser diode lifetime; laser materials processing; medical laser applications; microchanneled copper mounts; modern laser systems; plastics welding; reliability; soldering; Bars; Copper; Diode lasers; Laser applications; Laser modes; Materials processing; Packaging; Power generation; Power lasers; Solid lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics Society Annual Meeting, 1998. LEOS '98. IEEE
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    0-7803-4947-4
  • Type

    conf

  • DOI
    10.1109/LEOS.1998.739800
  • Filename
    739800