DocumentCode
2475461
Title
Packaging high-power diode laser bars using microchanneled copper mounts
Author
Loosen, Peter ; Ebert, Thomas ; Jandeleit, Jürgen ; Treusch, Georg
Author_Institution
Fraunhofer-Inst. fur Mikrostrukturtech., Berlin, Germany
Volume
2
fYear
1998
fDate
3-4 Dec 1998
Firstpage
434
Abstract
High-power diode lasers with an average output power of several 10 W and above are growing into key components for modern laser systems and applications in, e.g. materials processing and medicine. Solid state lasers strongly benefit from the higher laser beam quality, lifetime and reliability as well as from the lower energy consumption and floor space requirement which are possible if diode lasers are used instead of conventional lamps. In diode lasers for direct applications in, e.g. soldering and plastics welding most of these advantages even become more evident
Keywords
laser applications in medicine; laser beams; laser materials processing; laser reliability; packaging; semiconductor lasers; 10 W; Cu; average output power; high-power diode laser bar packaging; key components; laser beam quality; laser diode lifetime; laser materials processing; medical laser applications; microchanneled copper mounts; modern laser systems; plastics welding; reliability; soldering; Bars; Copper; Diode lasers; Laser applications; Laser modes; Materials processing; Packaging; Power generation; Power lasers; Solid lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society Annual Meeting, 1998. LEOS '98. IEEE
Conference_Location
Orlando, FL
Print_ISBN
0-7803-4947-4
Type
conf
DOI
10.1109/LEOS.1998.739800
Filename
739800
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