DocumentCode
2475772
Title
P0-18 Forward-Looking IVUS Imaging Using a Dual-Annular Ring CMUT Array: Experimental Results
Author
Guldiken, R. ; Zahorian, J. ; Gurun, G. ; Qureshi, M.S. ; Balantekin, M. ; Tekes, C. ; Hasler, P. ; Karaman, M. ; Carlier, S. ; Degertekin, F.L.
Author_Institution
Georgia Inst. of Technol., Atlanta
fYear
2007
fDate
28-31 Oct. 2007
Firstpage
1247
Lastpage
1250
Abstract
This paper presents the experimental results on forward-looking intravascular ultrasound (FL-IVUS) using dual- annular-ring CMUT arrays. The array has a diameter of 1mm including bondpads which consists of separate, concentric 24 transmit and 32 receive ring arrays built on the same silicon substrate. This configuration has the potential for independent optimization of each array and uses the silicon area more effectively without any drawback. For imaging experiments, we designed and constructed a custom integrated circuit using a standard 0.5mum CMOS process for data acquisition. A sample pulse-echo signal received from the oil-air interface (plane reflector) at 6 mm had a center frequency of 11 MHz with 95*% fractional 6-dB bandwidth. The measured SNR of the echo was 24 dB with no averaging. B-scan image of a wire-phantom was generated to test the resolution.
Keywords
CMOS integrated circuits; biomedical electronics; biomedical transducers; biomedical ultrasonics; blood vessels; capacitive sensors; image resolution; microsensors; phantoms; ultrasonic transducer arrays; B-scan image; CMOS process; Si; capacitive micromachined ultrasound transducer design; data acquisition; dual-annular ring CMUT array; forward-looking IVUS imaging; frequency 11 MHz; image resolution; intravascular ultrasound imaging; oil-air interface; plane reflector; pulse-echo signal; receive ring arrays; size 0.5 mum; transmit ring arrays; wire phantom; Application specific integrated circuits; Bandwidth; Bonding; CMOS process; Data acquisition; Frequency; Integrated circuit measurements; Testing; Ultrasonic imaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2007. IEEE
Conference_Location
New York, NY
ISSN
1051-0117
Print_ISBN
978-1-4244-1383-6
Electronic_ISBN
1051-0117
Type
conf
DOI
10.1109/ULTSYM.2007.313
Filename
4409886
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