• DocumentCode
    2475772
  • Title

    P0-18 Forward-Looking IVUS Imaging Using a Dual-Annular Ring CMUT Array: Experimental Results

  • Author

    Guldiken, R. ; Zahorian, J. ; Gurun, G. ; Qureshi, M.S. ; Balantekin, M. ; Tekes, C. ; Hasler, P. ; Karaman, M. ; Carlier, S. ; Degertekin, F.L.

  • Author_Institution
    Georgia Inst. of Technol., Atlanta
  • fYear
    2007
  • fDate
    28-31 Oct. 2007
  • Firstpage
    1247
  • Lastpage
    1250
  • Abstract
    This paper presents the experimental results on forward-looking intravascular ultrasound (FL-IVUS) using dual- annular-ring CMUT arrays. The array has a diameter of 1mm including bondpads which consists of separate, concentric 24 transmit and 32 receive ring arrays built on the same silicon substrate. This configuration has the potential for independent optimization of each array and uses the silicon area more effectively without any drawback. For imaging experiments, we designed and constructed a custom integrated circuit using a standard 0.5mum CMOS process for data acquisition. A sample pulse-echo signal received from the oil-air interface (plane reflector) at 6 mm had a center frequency of 11 MHz with 95*% fractional 6-dB bandwidth. The measured SNR of the echo was 24 dB with no averaging. B-scan image of a wire-phantom was generated to test the resolution.
  • Keywords
    CMOS integrated circuits; biomedical electronics; biomedical transducers; biomedical ultrasonics; blood vessels; capacitive sensors; image resolution; microsensors; phantoms; ultrasonic transducer arrays; B-scan image; CMOS process; Si; capacitive micromachined ultrasound transducer design; data acquisition; dual-annular ring CMUT array; forward-looking IVUS imaging; frequency 11 MHz; image resolution; intravascular ultrasound imaging; oil-air interface; plane reflector; pulse-echo signal; receive ring arrays; size 0.5 mum; transmit ring arrays; wire phantom; Application specific integrated circuits; Bandwidth; Bonding; CMOS process; Data acquisition; Frequency; Integrated circuit measurements; Testing; Ultrasonic imaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2007. IEEE
  • Conference_Location
    New York, NY
  • ISSN
    1051-0117
  • Print_ISBN
    978-1-4244-1383-6
  • Electronic_ISBN
    1051-0117
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2007.313
  • Filename
    4409886