• DocumentCode
    2476673
  • Title

    P1H-4 FBAR Characteristics with AlN Film Using MOCVD Method and Ru/Ta Electrode

  • Author

    Aota, Y. ; Tanifuji, S. ; Oguma, H. ; Kameda, S. ; Nakase, H. ; Takagi, T. ; Tsubouchi, K.

  • Author_Institution
    Tohoku Univ., Sendai
  • fYear
    2007
  • fDate
    28-31 Oct. 2007
  • Firstpage
    1425
  • Lastpage
    1428
  • Abstract
    Film bulk acoustic resonator (FBAR) was fabricated using high oriented AlN(0002) film obtained through the metal-organic chemical vapor deposition (MOCVD) method. We used the Ru/Ta bottom electrode to improve the FBAR resonant characteristics because Ru has a high acoustic impedance and a hexagonal crystalline that is effective to obtaine the high oriented AlN(0002) film. The Ru/Ta electrode had good characteristics under 1100degC in points of the full width at half maximum (FWHM) of Ru(0002), the surface roughness and the electrode resistivity. The evaluated FWHM of AlN(0002) on Ru/Ta at 1050degC was exellent value of 1.2deg. The resonant frequency and anti-resonant frequency of the fabricated FBAR using the Ru/Ta bottom electrode were 5.217 GHz and 5.479 GHz, respectively. The resistance of the FBAR electrodes and of the series-resonance part in modified Butterworth Van Dyke (MBVD) equivalent circuit were improved to 4.3 Omega from 7.0 Omega and to 0.5 Omega from 3.0 Omega compared to the results of previous Mo bottom electrode, respectively. The effective electro-mechanical coupling coefficient (keff 2) of the fabricated FBAR was exellent value of 7.0 % and the evaluated Qr was 329. We successfully fabricated the FBAR with the small insertion loss and the large keff 2 using the Ru/Ta bottom electrode and high oriented AlN(0002) film.
  • Keywords
    III-V semiconductors; MOCVD; acoustic resonators; aluminium compounds; bulk acoustic wave devices; electrodes; equivalent circuits; piezoelectric thin films; ruthenium; semiconductor thin films; tantalum; thin film devices; wide band gap semiconductors; AlN; AlN film; Butterworth Van Dyke equivalent circuit; FBAR electrodes; FBAR resonant characteristics; MOCVD; Ru-Ta; Ru-Ta electrode; acoustic impedance; electro-mechanical coupling coefficient; electrode resistivity; film bulk acoustic resonator; frequency 5.217 GHz; frequency 5.479 GHz; insertion loss; metal-organic chemical vapor deposition; surface roughness; temperature 1050 C; temperature 1100 C; Chemical vapor deposition; Crystallization; Electrodes; Film bulk acoustic resonators; MOCVD; Resonance; Rough surfaces; Surface impedance; Surface resistance; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2007. IEEE
  • Conference_Location
    New York, NY
  • ISSN
    1051-0117
  • Print_ISBN
    978-1-4244-1384-3
  • Electronic_ISBN
    1051-0117
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2007.358
  • Filename
    4409931