P2H-5 Small 3x2.5mm² Sized Surface Acoustic Wave Duplexer for US-PCS with Excellent Temperature and Frequency Characteristics

Author

Nakao, Takeshi ; Kadota, Michio ; Nishiyama, Kenji ; Nakai, Yasuharu ; Yamamoto, Daisuke ; Ishiura, Yutaka ; Komura, Tomohisa ; Takada, Norihiko ; Kita, Ryoichi

Author_Institution

Murata Manuf. Co., Ltd., Kyoto

fYear

2007

fDate

28-31 Oct. 2007

Firstpage

1681

Lastpage

1684

Abstract

Using flattened-SiO₂/Cu-electrode/36~48deg LiTaO₃ structure, small size (5 x5mm²) surface acoustic wave (SAW) duplexer with a good temperature coefficient of frequency (TCF) for US-PCS was realized by authors. However, a smaller duplexer has been strongly required. Using flip-chip bonding process of SAW chips and Rayleigh SAW propagating on the flattened-SiO₂/Cu- electrode/126~128degYX-LiNbO₃, which has larger cou pling factor than above-mentioned substrate, a smaller sized (3x2.5mm²) SAW duplexer with a good TCF has been realized.

Keywords

copper; flip-chip devices; lithium compounds; multiplexing equipment; personal communication networks; piezoelectricity; silicon compounds; surface acoustic wave devices; Rayleigh SAW propagation; SAW chips; SiO₂-Cu-LiNbO₃; SiO₂-Cu-LiTaO₃; US Personal Communication Services; coupling factor; flip-chip bonding process; surface acoustic wave duplexer; temperature coefficient of frequency; Acoustic waves; Bonding; Filters; Frequency; Personal communication networks; Reflection; Substrates; Surface acoustic waves; Temperature; Wires;

fLanguage

English

Publisher

ieee

Conference_Titel

Ultrasonics Symposium, 2007. IEEE

Conference_Location

New York, NY

ISSN

1051-0117

Print_ISBN

978-1-4244-1384-3

Electronic_ISBN

1051-0117

Type

conf

DOI

10.1109/ULTSYM.2007.423

Filename

4409996