• DocumentCode
    2479017
  • Title

    P3G-1 The Evaluation of Nonpermanent Acoustic Bonding Materials Incorporating Micron Size Particles

  • Author

    Hickernell, Fred S.

  • Author_Institution
    Univ. of Arizona, Tucson
  • fYear
    2007
  • fDate
    28-31 Oct. 2007
  • Firstpage
    1858
  • Lastpage
    1861
  • Abstract
    Nonpermanent acoustic bonding agents are important for the transfer of acoustic energy between materials without permanently bonding them. Their use extends over a wide range of applications which encompass industrial, medical, and research applications. In the case of bonding solids, nonpermanent bonding agents have elastic properties well below those of the solids to which they often are bonded. By increasing the density of the nonpermanent bonding agents their elastic properties come closer to those of the solid materials. The work reported here characterizes the transfer efficiency of selectively loaded nonpermanent bonding agents in the frequency region from 200 MHz to 600 MHz using two fused quartz blocks with zinc oxide transducers formed at each end and the loaded bond material applied between the blocks opposite the transducers. The nonpermanent bonding materials which could be most conveniently loaded with fine particles were waxes and resins. Micron size particles of aluminum oxide, diamond and silicon carbide, were the main particles used. The transfer efficiency is compared to both a bond condition without particle loading and an optical bond condition.
  • Keywords
    acoustic impedance; acoustic materials; aluminium compounds; bonding processes; diamond; elasticity; impurities; resins; silicon compounds; waxes; C; SiC; SiO2; acoustic energy transfer; aluminum oxide; diamond; elastic properties; frequency 200 MHz to 600 MHz; micron size particles; nonpermanent acoustic bonding materials; resins; silicon carbide; solid bonding; waxes; Acoustic materials; Aluminum oxide; Biomedical acoustics; Bonding; Frequency; Optical materials; Resins; Solids; Transducers; Zinc oxide;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 2007. IEEE
  • Conference_Location
    New York, NY
  • ISSN
    1051-0117
  • Print_ISBN
    978-1-4244-1384-3
  • Electronic_ISBN
    1051-0117
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2007.467
  • Filename
    4410040