DocumentCode
2479017
Title
P3G-1 The Evaluation of Nonpermanent Acoustic Bonding Materials Incorporating Micron Size Particles
Author
Hickernell, Fred S.
Author_Institution
Univ. of Arizona, Tucson
fYear
2007
fDate
28-31 Oct. 2007
Firstpage
1858
Lastpage
1861
Abstract
Nonpermanent acoustic bonding agents are important for the transfer of acoustic energy between materials without permanently bonding them. Their use extends over a wide range of applications which encompass industrial, medical, and research applications. In the case of bonding solids, nonpermanent bonding agents have elastic properties well below those of the solids to which they often are bonded. By increasing the density of the nonpermanent bonding agents their elastic properties come closer to those of the solid materials. The work reported here characterizes the transfer efficiency of selectively loaded nonpermanent bonding agents in the frequency region from 200 MHz to 600 MHz using two fused quartz blocks with zinc oxide transducers formed at each end and the loaded bond material applied between the blocks opposite the transducers. The nonpermanent bonding materials which could be most conveniently loaded with fine particles were waxes and resins. Micron size particles of aluminum oxide, diamond and silicon carbide, were the main particles used. The transfer efficiency is compared to both a bond condition without particle loading and an optical bond condition.
Keywords
acoustic impedance; acoustic materials; aluminium compounds; bonding processes; diamond; elasticity; impurities; resins; silicon compounds; waxes; C; SiC; SiO2; acoustic energy transfer; aluminum oxide; diamond; elastic properties; frequency 200 MHz to 600 MHz; micron size particles; nonpermanent acoustic bonding materials; resins; silicon carbide; solid bonding; waxes; Acoustic materials; Aluminum oxide; Biomedical acoustics; Bonding; Frequency; Optical materials; Resins; Solids; Transducers; Zinc oxide;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2007. IEEE
Conference_Location
New York, NY
ISSN
1051-0117
Print_ISBN
978-1-4244-1384-3
Electronic_ISBN
1051-0117
Type
conf
DOI
10.1109/ULTSYM.2007.467
Filename
4410040
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