DocumentCode
2479284
Title
P3K-1 Low Sound Speed and Acoustic Attenuation Silicone Rubber Lens Based on Heavy Density Ceramic Nanopowder Composite for Medical Array Probe
Author
Hosono, Yasuharu ; Itsumi, Kazuhiro ; Yamashita, Yohachi
Author_Institution
Toshiba Corp., Kawasaki
fYear
2007
fDate
28-31 Oct. 2007
Firstpage
1913
Lastpage
1916
Abstract
Effects of Yb2O3 fine dopant (16 nm) on the acoustic properties of a high-temperature-vulcanization (HTV) silicone rubber have been investigated, in order to develop a new acoustic lens material with a low acoustic attenuation (alpha) for the medical array probe application. The HTV silicone rubber has advantages in that it shows a lower alpha than that of a room-temperature-vulcanization (RTV) silicone rubber and it can be mixed by applying shear stress, using roll-milling equipment. Roll-milling time dependence of the HTV silicone rubber indicates that the alpha is closely affected by the dispersion of nanopowders in the rubber matrix. The 8 vol% Yb2O3 doped HTV silicone rubber mixed for 30 minutes showed the lowest a of 0.73 dB/mm/MHz with an acoustic impedance (AI= sound speed (c) x density (rho)) of 1.43 times 106 kg/m2s at 37degC. Moreover, simulation results reveal that a 5 MHz linear probe using the HTV silicone rubber doped with Yb2O3 powder showed relative sensitivity around 2.6 dB higher than that in the case of using the RTV silicone rubber doped with Yb2O3 powder.
Keywords
acoustic materials; acoustic wave absorption; biomedical materials; ceramics; composite materials; rolling mills; silicone rubber; ytterbium compounds; acoustic attenuation; acoustic lens; heavy density ceramic nanopowder composite; high-temperature-vulcanization silicone rubber; low sound speed material; medical array probe application; roll milling; room-temperature-vulcanization silicone rubber; silicone rubber lens; Acoustic applications; Acoustic arrays; Attenuation; Bioceramics; Biomedical acoustics; Lenses; Optical materials; Powders; Probes; Rubber;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 2007. IEEE
Conference_Location
New York, NY
ISSN
1051-0117
Print_ISBN
978-1-4244-1384-3
Electronic_ISBN
1051-0117
Type
conf
DOI
10.1109/ULTSYM.2007.481
Filename
4410054
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