• DocumentCode
    2479859
  • Title

    Perspectives of new materials research for thermoelectric applications

  • Author

    Matsubara, Kakuei

  • Author_Institution
    Fac. of Sci. & Eng., Sci. Univ. of Tokyo, Japan
  • fYear
    1998
  • fDate
    24-28 May 1998
  • Firstpage
    1
  • Lastpage
    8
  • Abstract
    A possibility of increasing the thermoelectric figure-of-merit of materials has bent definitely identified by the use of different fabrication techniques. An attempt at rf-plasma processing has been made to improve the figure-of-merit of iron disilicides β-FeSi2 . In addition, our recent results on the skutterudites CoSb3 and related-materials are reported. The lattice thermal conductivity κL of CoSb3 is a factor of 7 to 10 higher than that of a state-of-art thermoelectric material such as Bi 2Te3/Sb2Te3. This can be lowered to some degree by mixed-valence alloying. The κL of n-type Co0.9(PdPt)0.1Sb3 was 0.025 W/cmK, which was one-fifths smaller than that of CoSb3, which led to a ZT value of 0.9 at 800 K. However, the reduction in the lattice thermal conductivity by the mixed-valence alloying is limited. The lattice thermal conductivity is strongly affected by the Debye temperature ΘD of materials; therefore, the first matter to be settled may be to lower the value of ΘD for improving the figure-of-merit
  • Keywords
    Debye temperature; Hall mobility; cobalt compounds; iron compounds; thermal conductivity; thermoelectricity; 800 K; Co0.9(PdPt)0.1Sb3; CoSb3; Debye temperature; FeSi2; RF plasma processing; mixed-valence alloying; skutterudites; thermal conductivity; thermoelectric figure-of-merit; Alloying; Bismuth; Conducting materials; Fabrication; Iron; Lattices; Tellurium; Thermal conductivity; Thermal factors; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 1998. Proceedings ICT 98. XVII International Conference on
  • Conference_Location
    Nagoya
  • ISSN
    1094-2734
  • Print_ISBN
    0-7803-4907-5
  • Type

    conf

  • DOI
    10.1109/ICT.1998.740307
  • Filename
    740307