DocumentCode
2481783
Title
Packaging for fiber in board electro-optical interconnection
Author
Delbare, Wim ; Lauwers, Erik ; Qingsheng, Tan ; Vandewege, Jan ; Verbeke, Jan
Author_Institution
Lab. of Electromagn. & Acoust., Ghent Univ., Belgium
fYear
1993
fDate
15-18 Nov 1993
Firstpage
470
Lastpage
471
Abstract
The fiber in board electro-optical interconnection system is developed to meet the interconnection requirements of broadband exchanges. The paper briefly describes the interconnection problem inside broadband exchanges. The principles of the fiber in board technology are made clear. The design of a fiber in board compatible multifiber package is described
Keywords
broadband networks; integrated optoelectronics; optical communication equipment; optical fibre communication; optical interconnections; packaging; broadband exchanges; design; fiber in board compatible multifiber package; fiber in board electro-optical interconnection; fiber in board technology; packaging; Glass; High speed optical techniques; Integrated circuit interconnections; Optical crosstalk; Optical fiber cables; Optical fibers; Optical interconnections; Optical receivers; Optical surface waves; Packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics Society Annual Meeting, 1993. LEOS '93 Conference Proceedings. IEEE
Conference_Location
San Jose, CA
Print_ISBN
0-7803-1263-5
Type
conf
DOI
10.1109/LEOS.1993.379264
Filename
379264
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