DocumentCode
2481784
Title
New 3D low loss, wide band microwave interconnection
Author
Monfraix, P. ; Coello Vera, A. ; Llopis, O. ; Ulian, P. ; George, S. ; Drevon, C. ; Tronche, C. ; Graffeuil, J.
Author_Institution
ALCATEL TELECOM, Toulouse, France
Volume
3
fYear
1997
fDate
8-13 June 1997
Firstpage
1551
Abstract
This paper describes a new wide band [0; 40 GHz] vertical interconnection approach between two RF homogeneously grounded coplanar lines. It can be considered as two 90/spl deg/ vertical bends transition. Both electromagnetic simulation and measurement demonstrate very good results on the whole frequency range.
Keywords
integrated circuit interconnections; microwave integrated circuits; 0 to 40 GHz; 3D low loss wide band microwave interconnection; RF homogeneously grounded coplanar line; electromagnetic simulation; vertical bends transition; Costs; Electromagnetic measurements; Frequency measurement; Magnetic materials; Microstrip resonators; Probes; Radar; Radio frequency; Telecommunications; Wideband;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 1997., IEEE MTT-S International
Conference_Location
Denver, CO, USA
ISSN
0149-645X
Print_ISBN
0-7803-3814-6
Type
conf
DOI
10.1109/MWSYM.1997.596638
Filename
596638
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