DocumentCode
2483384
Title
Preparation and characteristic evaluation of hydrophobic epoxy-based nanocomposites
Author
Yamazaki, Kinya ; Imai, Tetsuro ; Ozaki, Takashi ; Cho, Hyeonwoo ; Sekiya, Hiroo ; Takeuchi, Masaru ; Tanaka, Mitsuru ; Asayama, M. ; Osako, T.
Author_Institution
Power & Ind. Syst. R&D Center, Toshiba Corp., Fuchu, Japan
fYear
2012
fDate
14-17 Oct. 2012
Firstpage
283
Lastpage
286
Abstract
Nanocomposite techniques are used to improve the electrical properties of epoxy materials, for example, insulation breakdown strength and partial discharge resistance. In the first step, we prepared epoxy-based nanocomposites by using hydrophobic epoxy as the base resin and 10wt% of titanium dioxide or 5wt% of layered silicate as nano fillers, and measured the partial discharge resistance and insulation breakdown strength. It was confirmed that the depth of the hole caused by partial discharge exposure was decreased to half and one-fourth and the insulation breakdown strength was increased by about 0.8% and 4% with the addition of titanium dioxide or layered silicate, respectively, as compared to the base resin. In the second step, we fabricated impregnated mica tapes, which have been widely used in high-voltage equipment, using nanocomposite epoxy as binder resins. We can see that, although the erosion depth was not changed significantly, the insulation breakdown strength was increased by about 35% and 8.7% in mica tapes containing titanium and layered silicate, respectively, compared with mica tape without nano-fillers.
Keywords
insulation; mica; nanocomposites; partial discharges; resins; titanium compounds; binder resins; characteristic evaluation; epoxy material electrical properties; erosion depth; high-voltage equipment; hydrophobic epoxy-based nanocomposites; impregnated mica tapes; insulation breakdown strength; layered silicate; nano fillers; nanocomposite epoxy; nanocomposite techniques; partial discharge exposure; partial discharge resistance; titanium dioxide; Glass; Insulation; Nanocomposites; Partial discharges; Resins; Resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2012 Annual Report Conference on
Conference_Location
Montreal, QC
ISSN
0084-9162
Print_ISBN
978-1-4673-1253-0
Electronic_ISBN
0084-9162
Type
conf
DOI
10.1109/CEIDP.2012.6378776
Filename
6378776
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