DocumentCode
2484172
Title
Interconnection reliability
Author
Reagor, Barbara T.
Author_Institution
Bell Commun. Res. Inc., Red Bank, NJ, USA
fYear
1988
fDate
9-11 May 1988
Firstpage
188
Lastpage
191
Abstract
The key factors that can affect interconnection reliability at all levels are summarized. They are manufacturing contamination, materials selection, lubrication, and environmental protection. Actual field failures are discussed
Keywords
electrical contacts; environmental testing; failure analysis; reliability; environmental protection; field failures; interconnection reliability; key factors; lubrication; manufacturing contamination; materials selection; Contamination; Digital systems; Lubrication; Manufacturing; Packaging; Semiconductor device manufacture; Stability; Switches; Telecommunication network reliability; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location
Los Angeles, CA
Type
conf
DOI
10.1109/ECC.1988.12592
Filename
12592
Link To Document