Extracting physical IC models using near-field scanning

Author

Yu, Zhenwei ; Koo, Jayong ; Mix, Jason A. ; Slattery, Kevin ; Fan, Jun

Author_Institution

EMC Lab., Missouri Univ. of Sci. & Technol., Rolla, MO, USA

fYear

2010

fDate

25-30 July 2010

Firstpage

317

Lastpage

320

Abstract

Accurate modeling of chip and chip-package is critical for EMI (Electromagnetic Interference) and RFI (RF Interference) analysis and prediction. In this paper, a model based on an array of dipoles from near-field measurement is proposed. A simple active circuit is simulated in a 3-D full-wave simulation tool, and the dipole model is calculated from the near-field data in the simulation using inverse method with regularization technique. This model has clear physical meaning, and it is validated using field at other place.

Keywords

active networks; integrated circuit packaging; inverse problems; radiofrequency interference; 3D full-wave simulation tool; EMI; RF interference analysis; RFI analysis; active circuit; chip-package; dipole model; electromagnetic interference analysis; inverse method; near-field measurement; near-field scanning; physical IC model extraction; regularization technique; Current measurement; Data models; Integrated circuit modeling; Inverse problems; Magnetic field measurement; Magnetic moments;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on

Conference_Location

Fort Lauderdale, FL

ISSN

2158-110X

Print_ISBN

978-1-4244-6305-3

Type

conf

DOI

10.1109/ISEMC.2010.5711292

Filename

5711292