DocumentCode
2487882
Title
Radiating emissions from the planar electromagnetic bandgap (EBG) structures
Author
Mohajer-Iravani, Baharak ; Ramahi, Omar M.
Author_Institution
EMWaveDev, Fayetteville, AR, USA
fYear
2010
fDate
25-30 July 2010
Firstpage
780
Lastpage
783
Abstract
Electromagnetic bandgap (EBG) structures are considered as a viable solution for the problem of switching noise in printed circuit boards and packages. Less attention, however, has been given to whether or not the introduction of EBGs affect the EMI potential of the circuit to couple unwanted energy to neighboring layers or interconnects. In this paper, we show that the bandgap of EBG structures, as generated using the Brillouin diagram, does not necessarily correspond to the suppression bandwidth generated using S-parameters. In fact, we show that the slow modes which typically exist at the edges of the bandgap of periodic structures contribute to increased radiation, even within the suppression band obtained from the S-parameters. We validate this finding using numerical simulation. Based on this work, design guidelines for EBG structures can be drawn to insure not only suppression of switching noise but also minimization of EMI.
Keywords
S-parameters; coupled circuits; electromagnetic interference; integrated circuit interconnections; integrated circuit noise; integrated circuit packaging; interference suppression; minimisation; periodic structures; photonic band gap; printed circuits; Brillouin diagram; EBG structures; EMI potential; S-parameters; interconnects; minimization; neighboring layers; periodic structures; planar electromagnetic bandgap structures; printed circuit boards; printed circuit packages; radiating emissions; suppression bandwidth; switching noise; unwanted energy; Dispersion; Electromagnetic interference; Metamaterials; Photonic band gap; Scattering; EBG structure; Emission; high speed packaging; power integrity; radiation; signal integrity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on
Conference_Location
Fort Lauderdale, FL
ISSN
2158-110X
Print_ISBN
978-1-4244-6305-3
Type
conf
DOI
10.1109/ISEMC.2010.5711378
Filename
5711378
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