• DocumentCode
    2488234
  • Title

    Full-wave evaluation of carbon nanotubes as microwave interconnects

  • Author

    Kim, Kichul ; Rice, Paul ; Kabos, Pavel ; Filipovic, Dejan S.

  • Author_Institution
    Dept. of Electr., Comput., & Energy Eng., Univ. of Colorado, Boulder, CO, USA
  • fYear
    2010
  • fDate
    25-30 July 2010
  • Firstpage
    853
  • Lastpage
    856
  • Abstract
    Microwave interconnect configurations composed of single wall carbon nanotubes (CNTs) are studied in this paper. Specifically, an atomic layer deposition (ALD) enabled nano-coaxial line with individual CNTs comprising the inner conductor, CNT Goubau line with ALD enabled alumina coating, a nano-coaxial line with inner conductor composed of CNT bundles, and Goubau lines of CNT bundles are discussed. The characteristic impedance and losses of these interconnects are compared with the similar size copper-based transmission lines. Full wave simulations with incorporated quantum effects are conducted using finite element and method of moments tools ANSYS HFSS 1 and EMSS FEKO1, respectively. A thorough modeling validation, interconnect design and analysis are carried out over the wide microwave spectrum. Obtained results clearly show that although their inherent loss and impedance are high, the CNT interconnects can indeed outperform their copper counterparts with lower loss and impedance, and that observation is reinforced with decreasing the CNT radius.
  • Keywords
    alumina; carbon nanotubes; electric impedance; finite element analysis; interconnections; method of moments; microwave materials; nanotube devices; ALD enabled alumina coating; C; CNT Goubau line; atomic layer deposition; characteristic impedance; characteristic losses; finite element method; full-wave evaluation; method of moments; microwave interconnects; nanocoaxial line; single wall carbon nanotubes; Carbon nanotubes; Coatings; Conductors; Copper; Finite element methods; Impedance; Integrated circuit interconnections;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (EMC), 2010 IEEE International Symposium on
  • Conference_Location
    Fort Lauderdale, FL
  • ISSN
    2158-110X
  • Print_ISBN
    978-1-4244-6305-3
  • Type

    conf

  • DOI
    10.1109/ISEMC.2010.5711391
  • Filename
    5711391