A shielded microstrip-to-stripline vertical transition for multilayer printed circuit board

Author

Huang, Qingchou ; Zhang, Shu ; Jiang, Wanshun

Author_Institution

41st Inst. of China Electron. Technol. Group, Corp. Nat. Key Lab. of Sci. & Technol. on Electron. Test & Meas., Qingdao, China

Volume

2

fYear

2012

fDate

5-8 May 2012

Firstpage

1

Lastpage

3

Abstract

This paper reports on a shielded vertical transition in multilayer PCBs. The design and analysis of microstrip-tostripline transition are presented, and back-to-back arrangements are considered. These interconnections are simulated and optimized by three-dimensional electromagnetic simulations, presents great performances from dc up to 40 GHz. A prototype is manufactured on RO4003c. Two band-pass filters in stripline technique are presented as the examples of application.

Keywords

microstrip filters; microstrip transitions; multilayers; printed circuits; strip line transitions; 3D electromagnetic simulations; back-to-back arrangements; band-pass filters; multilayer printed circuit board; shielded microstrip-to-stripline vertical transition; Band pass filters; Integrated circuit interconnections; Metallization; Microwave circuits; Microwave filters; Nonhomogeneous media; Stripline; PCB; Vertical transition; band-pass filter; blind via; microstrip-tostripline;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave and Millimeter Wave Technology (ICMMT), 2012 International Conference on

Conference_Location

Shenzhen

Print_ISBN

978-1-4673-2184-6

Type

conf

DOI

10.1109/ICMMT.2012.6230045

Filename

6230045