• DocumentCode
    2494011
  • Title

    Preface

  • fYear
    2009
  • fDate
    7-9 Oct. 2009
  • Abstract
    Presents the welcome message from the conference proceedings.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal Investigations of ICs and Systems, 2009. THERMINIC 2009. 15th International Workshop on
  • Conference_Location
    Leuven
  • Print_ISBN
    978-1-4244-5881-3
  • Type

    conf

  • Filename
    5340035