Stability of welding techniques used in single-mode laser packages

Author

Moyer, It S. ; Lipson, J. ; German, M.G. ; Kaufman, S. ; Hall, P.M. ; Coyle, R.J.

Author_Institution

AT&T Bell Lab., Reading, PA, USA

fYear

1988

fDate

9-11 May 1988

Firstpage

244

Lastpage

245

Abstract

Critical alignments of single-mode laser packages have been secured using laser welds and resistance welds. Two methods were used to ascertain submicron motions of the welded joints, which are caused primarily by stress relaxation: linear motion was measured by a Fraunhofer diffraction technique, and angular motion was measured by interferometry. Statistically significant groups of test joints were subjected to thermal stresses. Empirically derived design information is applied to ensure submicron mechanical stability of the device throughout its intended lifetime.<>

Keywords

angular measurement; distance measurement; laser beam welding; optical communication equipment; semiconductor junction lasers; stress relaxation; Fraunhofer diffraction technique; angular motion; empirically derived design techniques; groups of test joints; interferometry; laser welds; linear motion; resistance welds; single-mode laser packages; stress relaxation; submicron mechanical stability; submicron motions; thermal stresses; welded joints; welding techniques; Diffraction; Electrical resistance measurement; Interferometry; Laser stability; Motion measurement; Packaging; Stress measurement; Testing; Thermal stresses; Welding;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Components Conference, 1988., Proceedings of the 38th

Conference_Location

Los Angeles, CA, USA

Type

conf

DOI

10.1109/ECC.1988.12599

Filename

12599