• DocumentCode
    2496764
  • Title

    [Blank page]

  • fYear
    2008
  • fDate
    1-2 Dec. 2008
  • Firstpage
    154
  • Lastpage
    154
  • Abstract
    This page or pages intentionally left blank.
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Packaging Workshop of Japan, 2008. VPWJ 2008. IEEE 9th
  • Conference_Location
    Kyoto
  • Print_ISBN
    978-1-4244-3498-5
  • Type

    conf

  • DOI
    10.1109/VPWJ.2008.4762240
  • Filename
    4762240