DocumentCode
2496764
Title
[Blank page]
fYear
2008
fDate
1-2 Dec. 2008
Firstpage
154
Lastpage
154
Abstract
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fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Packaging Workshop of Japan, 2008. VPWJ 2008. IEEE 9th
Conference_Location
Kyoto
Print_ISBN
978-1-4244-3498-5
Type
conf
DOI
10.1109/VPWJ.2008.4762240
Filename
4762240
Link To Document