• DocumentCode
    2498704
  • Title

    Residual Stress and Membrane Deflection Influences on the Ultrasonic Sensor Device

  • Author

    Lee, Seung-Mock ; Tanaka, Tsunehisa ; Inoue, Koji

  • Author_Institution
    Ingen MSL INC., Osaka
  • fYear
    2006
  • fDate
    22-25 Oct. 2006
  • Firstpage
    1428
  • Lastpage
    1431
  • Abstract
    The influences of residual stress on the piezoelectric ultrasonic sensors having composite membrane structure included PZT (Pb(Zr0.52Ti0.48)O3) thin film are presented. Due to the different thermal and elastic characteristics of each constitutive layer, a subsequent residual stress and deflection is usually generated on the composite membrane. We discuss the influences of residual stress on the Si-based integrated sensor device in the two point of view; the mechanical behaviors and piezoelectric thin film properties. The composite layer structure and fabrication process especially related to thermal process have significant effects on the stress state of the composite membrane. The relationships among the stress states, deflections of composite membrane and sensitivities of sensor devices are considered.
  • Keywords
    composite materials; elemental semiconductors; internal stresses; lead compounds; membranes; piezoelectric thin films; piezoelectric transducers; silicon; thin film sensors; ultrasonic transducers; PZT; Pb(Zr0.52Ti0.48)O3; composite membrane structure; deflections; elastic characteristics; integrated sensor; piezoelectric thin film; piezoelectric ultrasonic sensors; residual stress; Biomembranes; Character generation; Fabrication; Mechanical factors; Mechanical sensors; Piezoelectric films; Residual stresses; Sensor phenomena and characterization; Thermal stresses; Thin film sensors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Sensors, 2006. 5th IEEE Conference on
  • Conference_Location
    Daegu
  • ISSN
    1930-0395
  • Print_ISBN
    1-4244-0375-8
  • Electronic_ISBN
    1930-0395
  • Type

    conf

  • DOI
    10.1109/ICSENS.2007.355901
  • Filename
    4178896