Semi-insulating polyimide as a high resistive material

Author

Iida, K. ; Mori, H. ; Nakamura, S. ; Sawa, G.

Author_Institution

Dept. of Electr. & Electron. Eng., Mie Univ., Tsu, Japan

fYear

1998

fDate

27-30 Sep 1998

Firstpage

169

Lastpage

172

Abstract

A new polymer, designed by extending π electron systems along the molecular chain, has been studied from the view point of a high resistive or semi-insulating material. A high resistive polyimide thin film of 10¹²-10¹⁴ Ω cm without a large absorption current below 40 kV/cm has been obtained by the vapor deposition polymerization with pyromellitic dianhydride and 4,4´-diaminostilbene. It is also found that an increase in the orientation of molecular chain axis with decreasing thickness yields lower resistivity and that the orientation of pyromellitdiimide has little effect on the resistivity

Keywords

electrical resistivity; insulating thin films; molecular orientation; polymer films; polymerisation; vapour deposited coatings; π-electron system; 4,4´-diaminostilbene; absorption current; molecular chain orientation; polyimide thin film; pyromellitic dianhydride; resistive material; resistivity; semi-insulating polymer; vapor deposition polymerization; Absorption; Conducting materials; Conductivity; Gold; Inorganic materials; Plastic insulation; Polyimides; Polymer films; Reflection; Voltage;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Insulating Materials, 1998. Proceedings of 1998 International Symposium on

Conference_Location

Toyohashi

Print_ISBN

4-88686-050-8

Type

conf

DOI

10.1109/ISEIM.1998.741712

Filename

741712