• DocumentCode
    2499400
  • Title

    Improvement of the heat resistance of epoxy casting resin for insulating spacers

  • Author

    Ichikawa, Ichiro ; Goto, Kazutoshi ; Takei, Masafumi ; Nakano, Toshiyuki ; Kanazashi, Yasutoshi

  • Author_Institution
    Power & Ind. Syst. R&D Center, Toshiba Corp., Japan
  • fYear
    1998
  • fDate
    27-30 Sep 1998
  • Firstpage
    281
  • Lastpage
    284
  • Abstract
    New research has succeeded in producing more compact insulating spacers for gas insulated switchgear (GIS) by increasing the heat resistance (from 105°C to 115°C) of casting resin and by increasing the heat resistance of the interface bond between metal and resin. The newly developed resin is composed, like conventional types, of epoxy resin blended with alumina filler. In the new compositions, both increased thermal resistance and favorable mechanical properties are achieved by reducing shrinkage during curing and the viscosity of the matrix resin, and by increasing the content of alumina filler. The creep rupture characteristics of the newly developed resin at 115°C equal those of conventional resin at 105°C
  • Keywords
    alumina; composite insulating materials; composite material interfaces; creep fracture; epoxy insulation; filled polymers; fracture toughness; gas insulated switchgear; shrinkage; thermal insulation; viscosity; 105 to 115 C; Al2O3; GIS; alumina filler; casting resin; compact insulating spacers; creep rupture; curing; epoxy casting resin; epoxy resin blend; gas insulated switchgear; heat resistance; insulating spacers; interface bond; matrix resin; mechanical properties; shrinkage; viscosity; Bonding; Casting; Epoxy resins; Gas insulation; Geographic Information Systems; Mechanical factors; Resistance heating; Space heating; Switchgear; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulating Materials, 1998. Proceedings of 1998 International Symposium on
  • Conference_Location
    Toyohashi
  • Print_ISBN
    4-88686-050-8
  • Type

    conf

  • DOI
    10.1109/ISEIM.1998.741740
  • Filename
    741740