Deformation study of the PCB during the flip chip assembly process using anisotropically conductive adhesive (ACA) as a bonding agent

Author

Pinardi, K. ; Liu, J. ; Haug, R. ; Treutler, C. ; Willander, M.

Author_Institution

Chalmers Univ. of Technol., Goteborg, Sweden

fYear

1998

fDate

28-30 Sep 1998

Firstpage

34

Lastpage

37

Abstract

In this work, the finite element method is used to simulate the flip chip assembly process using anisotropically conductive adhesive bonding. Since the structure is complex and consists of composite materials, we first study different models of the PCB substrate, which lead to different results in the numerical calculations. The stress during the assembly process is also discussed. We give preliminary results in optimisation of the stress generated by varying process parameters such as temperature and force

Keywords

adhesives; circuit optimisation; conducting polymers; deformation; filled polymers; finite element analysis; flip-chip devices; integrated circuit bonding; integrated circuit modelling; integrated circuit packaging; microassembling; printed circuits; stress analysis; ACA bonding agent; PCB deformation; PCB substrate models; anisotropically conductive adhesive; anisotropically conductive adhesive bonding; anisotropically conductive adhesive bonding agent; assembly process stress; composite materials; finite element method; flip chip assembly process; numerical calculations; process force; process parameters; process temperature; stress optimisation; Anisotropic magnetoresistance; Assembly; Bonding; Conductive adhesives; Contact resistance; Curing; Finite element methods; Flip chip; Glass; Residual stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on

Conference_Location

Binghamton, NY

Print_ISBN

0-7803-4934-2

Type

conf

DOI

10.1109/ADHES.1998.741999

Filename

741999