Microstrip-to-microstrip interconnects with conductive adhesive bonded ribbons for micro- and millimeter wave applications

Author

Pohlmann, W. ; Jacob, A.F. ; Schaefer, H. ; Hennemann, O.-D.

Author_Institution

Fraunhofer-Inst. for Appl. Mater. Res., Bremen, Germany

fYear

1998

fDate

28-30 Sep 1998

Firstpage

101

Lastpage

105

Abstract

A simple chip-to-chip interconnect technique with adhesive bonded ribbons is presented. It solves the insertion loss problem of wire bond interconnects in micro- and millimeter wave assemblies. This paper discusses design and fabrication of such interconnects. A quasi-static model is developed to ease the quality assessment of their electrical behaviour. It is validated by measurements on microstrip resonators with and without interconnects. The chip-to-chip interconnect technique with adhesive bonded ribbons exhibits low loss and is useable up to 50 GHz or more

Keywords

MIMIC; MMIC; adhesives; conducting polymers; electric connectors; integrated circuit bonding; integrated circuit design; integrated circuit interconnections; integrated circuit measurement; integrated circuit modelling; microstrip lines; microstrip resonators; 50 GHz; MIMIC; MMIC; adhesive bonded ribbons; chip-to-chip interconnect technique; conductive adhesive bonded ribbons; electrical behaviour; insertion loss; interconnect design; interconnect fabrication; interconnects; microstrip resonators; microstrip-to-microstrip interconnects; microwave applications; microwave assemblies; millimeter wave applications; millimeter wave assemblies; quality assessment; quasi-static model; wire bond interconnects; Assembly; Bonding; Conductive adhesives; Fabrication; Insertion loss; Microstrip; Millimeter wave measurements; Millimeter wave technology; Quality assessment; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on

Conference_Location

Binghamton, NY

Print_ISBN

0-7803-4934-2

Type

conf

DOI

10.1109/ADHES.1998.742010

Filename

742010