Advanced packaging and substrate technology using conductive adhesives

Author

Eda, Kazuo

Author_Institution

Device Eng. Dev. Center, Matsushita Electr. Ind. Co. Ltd., Osaka, Japan

fYear

1998

fDate

28-30 Sep 1998

Firstpage

144

Lastpage

151

Abstract

Packaging and substrate technology using conductive adhesives matches the trend for production of electronic equipment which is smaller, lighter and less expensive with high performance. Flexible interconnection using conductive adhesives seems a key technology for relaxation of the thermal stresses between the assembly elements in comparison with rigid interconnections such as solder joints. In this paper, packaging and substrate technologies using conductive adhesives, stud bump bonding (SBB) and ALIVH (any layer inner via hole) high density wiring board, are discussed

Keywords

adhesives; conducting polymers; filled polymers; integrated circuit bonding; integrated circuit interconnections; integrated circuit packaging; lead bonding; stress relaxation; thermal stresses; ALIVH high density wiring board; any layer inner via hole high density wiring board; assembly elements; conductive adhesives; electronic equipment; electronic equipment cost; electronic equipment performance; electronic equipment size; electronic equipment weight; flexible interconnection; packaging technology; rigid interconnections; solder joints; stud bump bonding; substrate technology; thermal stress relaxation; Assembly; Bonding; Conductive adhesives; Electronic equipment; Electronic packaging thermal management; Packaging machines; Production; Soldering; Thermal conductivity; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on

Conference_Location

Binghamton, NY

Print_ISBN

0-7803-4934-2

Type

conf

DOI

10.1109/ADHES.1998.742017

Filename

742017