DocumentCode
2503637
Title
Alternate safe solvents in hybrid circuit processing
Author
Riso, Anthony
Author_Institution
Rossi Technol. Corp., Orangeburg, NY, USA
fYear
1998
fDate
28-30 Sep 1998
Firstpage
174
Lastpage
177
Abstract
Hybrid circuit processing utilizes a number of types of materials in process and in end product manufacture. Our focus of concern is with the in-process materials. Here, we consider the fluxes used in soldering, solder paste, and adhesives and conductive epoxies. Defluxing remains an important aspect even when considering the usage of no-clean and water soluble flux. In most cases, flux removal is required to produce a trouble-free circuit and may also be required for aesthetics. Complete removal of flux remains the goal. Paste clean-up includes thick film and solder pastes. As fine lines and accurate paste deposition are mandated, complete paste removal from screens and stencils becomes critical where paste residues reduce print definition. Practice has produced a wide range of solvent chemicals for this cleaning process. This has been done without suppliers´ specific recommendation or support, since the bulk of these chemicals are commodity materials. In this paper, it is shown that many of these chemicals are toxic and/or health hazards. The objective here is to offer specific types of chemical solvents for the application that also provide an improvement upon and an alternative to the hazardous materials
Keywords
adhesives; conducting polymers; environmental factors; health hazards; hybrid integrated circuits; safety; soldering; surface cleaning; surface contamination; adhesives; chemical solvents; chemical toxicity; circuit aesthetics; cleaning process; commodity chemicals; conductive epoxies; defluxing; end product manufacture; fine lines; flux removal; hazardous materials; health hazards; hybrid circuit processing; in-process materials; no-clean flux; paste clean-up; paste deposition; paste residues; print definition; safe solvents; screen paste removal; solder paste; solder pastes; soldering flux; solvent chemicals; stencil paste removal; thick film pastes; water soluble flux; Chemical hazards; Chemical processes; Circuits; Cleaning; Conducting materials; Manufacturing processes; Soldering; Solvents; Thick films; Toxic chemicals;
fLanguage
English
Publisher
ieee
Conference_Titel
Adhesive Joining and Coating Technology in Electronics Manufacturing, 1998. Proceedings of 3rd international Conference on
Conference_Location
Binghamton, NY
Print_ISBN
0-7803-4934-2
Type
conf
DOI
10.1109/ADHES.1998.742023
Filename
742023
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