DocumentCode
2504460
Title
Multilayer thin-film substrate for multichip packaging
Author
Chao, Clinton C. ; Scholz, K.D. ; Leibovitz, Jacques ; Cobarruviaz, Maria L. ; Chang, Cheng C.
Author_Institution
Hewlett-Packard Co., Palo Alto, CA, USA
fYear
1988
fDate
9-11 May 1988
Firstpage
276
Lastpage
281
Abstract
Multilayer thin-film module technologies for high-performance multiple-chip module (MCM) packaging were developed and integrated. The technologies, which feature four copper layers, polyimide dielectric, controlled impedance-transmission lines, and solder-bump assembly, were demonstrated on a variety of vehicles including a 4K RAM module operating above 10-MHz clock frequency. The generic MCM substrate technology is described. The process can be designed to be compatible with a number of substrate materials.<>
Keywords
hybrid integrated circuits; packaging; thin film circuits; 100 MHz; 4 Kbit; 4K RAM module; Cu layers; clock frequency; controlled impedance-transmission lines; generic MCM substrate technology; high-performance; multichip packaging; multiple-chip module; polyimide dielectric; solder-bump assembly; substrate materials; thin-film module technologies; Assembly; Copper; Dielectric substrates; Dielectric thin films; Impedance; Nonhomogeneous media; Packaging; Polyimides; Transistors; Vehicles;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Components Conference, 1988., Proceedings of the 38th
Conference_Location
Los Angeles, CA, USA
Type
conf
DOI
10.1109/ECC.1988.12605
Filename
12605
Link To Document