• DocumentCode
    2504525
  • Title

    A fast multipole method based calculation of the capacitance matrix in a stratified medium

  • Author

    Yuancheng Chris Pan ; Li Xi Wan ; Weng Cho Chew

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Illinois Univ., Urbana, IL, USA
  • Volume
    4
  • fYear
    2000
  • fDate
    16-21 July 2000
  • Firstpage
    1876
  • Abstract
    An efficient, static fast multipole method (FMM) based algorithm is presented for the evaluation of the parasitic capacitance of 3-D microstrip signal lines in stratified dielectric media. The effect of dielectric interfaces on the capacitance matrix is included in the stage of the FMM when multipole expansions are used to form local multipole expansions, by the use of interpolated multipole-to-local translation functions. The increase in computational complexity and memory usage due to the presence of stratified media is therefore very small. The algorithm retains the structure and the O(N) computational cost and memory use of the free-space FMM, where N is the number of conductor patches.
  • Keywords
    capacitance; computational complexity; dielectric materials; inhomogeneous media; interpolation; matrix algebra; microstrip lines; waveguide theory; 3D microstrip signal lines; FMM based algorithm; capacitance matrix; computational complexity; computational cost; conductor patches; dielectric interfaces; fast multipole method; free-space FMM; interpolated multipole-to-local translation functions; local multipole expansions; memory usage; memory use; multipole expansions; parasitic capacitance; stratified dielectric media; stratified medium; Computational complexity; Computational efficiency; Computational electromagnetics; Conductors; Dielectrics; Integral equations; Microstrip; Nonhomogeneous media; Parasitic capacitance; Transmission line matrix methods;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Antennas and Propagation Society International Symposium, 2000. IEEE
  • Conference_Location
    Salt Lake City, UT, USA
  • Print_ISBN
    0-7803-6369-8
  • Type

    conf

  • DOI
    10.1109/APS.2000.874855
  • Filename
    874855