Thermal analysis of integrated polymer waveguides

Optical interconnection technology will be indispensable for high-bandwidth signal transmission in future transmission systems. The optical attenuation of light-guiding structures incorporated into printed circuit boards is an important quality characteristic and can be useful to describe the reliability of the waveguides. The purpose of the analysis described in this paper is to determine the functional behaviour of an integrated polymer waveguide under thermal stress. The data obtained will be used to conclude about occurring degradation mechanisms. In order to measure the optical attenuation under elevated temperature dedicated set-ups have been developed. One special set-up allows attenuation measurements with an increased repeatability by utilization of an immersion liquid. It also enables one to continuously track the changes of the optical losses at different temperatures. Main purpose of the measurement is testing the reliability of new elaborated technology of polymer waveguides. First measurement results were presented.