DocumentCode
2504853
Title
Ecological technologies for soldering without lead in electronic and telecommunications - today and tomorrow
Author
Mihaescu, Radu ; Carstea, Hona
Author_Institution
Dept. of Operations, ALCATEL NS, Timisoara, Romania
fYear
2003
fDate
8-11 May 2003
Firstpage
232
Lastpage
234
Abstract
In context of todays technological development, the European Union has elaborated an order regarding the development of the electrical and electronical equipment, banning the use lead in special soldering alloys from electronic and electrotechnical fields, starting with 2006. In order to minimize the environmental risks, the recycling law forced the manufacturers of the electrical and electronical equipments to recover and recycle the out of service devices. Based on didactical experience and on authors research, this work paper presents a synthesis of the most recent studies from famous companies, regarding the development of new materials and technologies, which can successfully replace with minimum costs the traditional technology based on tin-lead (Sn-Pb) soldering. This work paper analyzes the logistics, availability and reliability of the most suitable substitutes for the alloy based on lead, and the techniques for recycling-reusing-revaluation of the-new ecological alloys and also the costs involved by these new technologies.
Keywords
electron device manufacture; electronic equipment manufacture; electronics industry; environmental factors; lead alloys; recycling; tin alloys; SnPb; ecological alloys; ecological technologies; electrical equipment development; electrical equipment manufacturers; electronical equipment development; electronical equipments manufacturer; environmental risks; lead alloy; recycling law; reliability; service devices; special soldering alloys; technological development; tin-lead soldering; Bismuth; Chemical technology; Copper alloys; Costs; Lead; Paper technology; Soldering; Temperature; Tin alloys; Zinc;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on
Print_ISBN
0-7803-8002-9
Type
conf
DOI
10.1109/ISSE.2003.1260522
Filename
1260522
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