• DocumentCode
    2504853
  • Title

    Ecological technologies for soldering without lead in electronic and telecommunications - today and tomorrow

  • Author

    Mihaescu, Radu ; Carstea, Hona

  • Author_Institution
    Dept. of Operations, ALCATEL NS, Timisoara, Romania
  • fYear
    2003
  • fDate
    8-11 May 2003
  • Firstpage
    232
  • Lastpage
    234
  • Abstract
    In context of todays technological development, the European Union has elaborated an order regarding the development of the electrical and electronical equipment, banning the use lead in special soldering alloys from electronic and electrotechnical fields, starting with 2006. In order to minimize the environmental risks, the recycling law forced the manufacturers of the electrical and electronical equipments to recover and recycle the out of service devices. Based on didactical experience and on authors research, this work paper presents a synthesis of the most recent studies from famous companies, regarding the development of new materials and technologies, which can successfully replace with minimum costs the traditional technology based on tin-lead (Sn-Pb) soldering. This work paper analyzes the logistics, availability and reliability of the most suitable substitutes for the alloy based on lead, and the techniques for recycling-reusing-revaluation of the-new ecological alloys and also the costs involved by these new technologies.
  • Keywords
    electron device manufacture; electronic equipment manufacture; electronics industry; environmental factors; lead alloys; recycling; tin alloys; SnPb; ecological alloys; ecological technologies; electrical equipment development; electrical equipment manufacturers; electronical equipment development; electronical equipments manufacturer; environmental risks; lead alloy; recycling law; reliability; service devices; special soldering alloys; technological development; tin-lead soldering; Bismuth; Chemical technology; Copper alloys; Costs; Lead; Paper technology; Soldering; Temperature; Tin alloys; Zinc;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on
  • Print_ISBN
    0-7803-8002-9
  • Type

    conf

  • DOI
    10.1109/ISSE.2003.1260522
  • Filename
    1260522