Microelectronics packaging education related projects at BUTE-ETT

Author

Illyefalvi-Vitéz, Zsolt

Author_Institution

Dept. of Electron. Technol., Budapest Univ. of Technol. & Econ., Hungary

fYear

2003

fDate

8-11 May 2003

Firstpage

362

Lastpage

368

Abstract

The paper gives an overview on the objectives and the progress of three European Commission sponsored projects, which are in connection with microelectronics packaging education. The role of the Department of Electronics Technology at Budapest University of Technology and Economics, as well as, the benefits of colleagues and institutions of the Newly Associate States (NAS) countries is discussed. The following three projects are in the scope: 1. NETPACK: Network of Excellence in Microelectronics Packaging (www.netpack-europe.org); 2. EuroTraining: Provision of microsystems and related training in Europe (www.eutraining.net); 3. IPCI: Performance Centred Vocational Education - the link between work and education (Leonardo Pilot Project).

Keywords

integrated circuit packaging; training; BUTE-ETT; EuroTraining; IPCI; Leonardo Pilot Project; NETPACK; Network of Excellence in Microelectronics Packaging; Performance Centred Vocational Education; microelectronics packaging education; microsystems training; Cultural differences; Educational technology; Electronics packaging; Europe; Face recognition; Global communication; Internet; Microelectronics; Portals; Space technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Technology: Integrated Management of Electronic Materials Production, 2003. 26th International Spring Seminar on

Print_ISBN

0-7803-8002-9

Type

conf

DOI

10.1109/ISSE.2003.1260552

Filename

1260552