Modeling of spiral and meander lines in multilayer passive integration

Author

Kelander, Ilkka ; Arslan, Ali ; Hurskainen, Ville

Author_Institution

Nokia Res. Center, Espoo, Finland

fYear

2002

fDate

21-23 Oct. 2002

Firstpage

83

Lastpage

86

Abstract

In this paper, we present design and modeling techniques for transmission line passive components integrated on multilayer LTCC package. We discuss and characterize spiral and meander type lines, which may enable considerable size and cost reduction of RF modules.

Keywords

baluns; ceramic packaging; coupled transmission lines; equivalent circuits; high-frequency transmission lines; hybrid integrated circuits; impedance convertors; integrated circuit packaging; radiofrequency filters; radiofrequency integrated circuits; waveguide couplers; RF modules; baluns; cost reduction; couplers; design techniques; filters; impedance transformers; meander type lines; modeling; multilayer LTCC package integration; multilayer passive integration; size reduction; spiral type lines; transmission line passive components; Capacitance; Ceramics; Coupling circuits; Impedance; Nonhomogeneous media; Radio frequency; Spirals; Strips; Temperature; Transmission lines;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2002 IEEE 11th Topical Meeting on

Conference_Location

Monterey, CA, USA

Print_ISBN

0-7803-7451-7

Type

conf

DOI

10.1109/EPEP.2002.1057888

Filename

1057888