The influence of pad geometry on ceramic ball grid array solder joint reliability

Author

Yee, Shelgon ; Ladhar, Harjinder

Author_Institution

Solectron Corp., Milpitas, CA, USA

fYear

1996

fDate

14-16 Oct 1996

Firstpage

267

Lastpage

273

Abstract

The reliability of the solder joints on dog bone pads with hot air solder levelling (HASL) finish was found to be statistically different and less reliable than other combinations. The reliability of all other combinations was not significantly different. Both pad geometries and surface finishes evaluated in this study produced excellent, reliable solder joints. The selection of the pad geometry and surface finish will not have significant impact on CBGA solder joint reliability. Since the study was based on mechanical deflection system (MDS) test technology, the limitations for MDS will apply. Additional accelerated thermal cycling (ATC) tests to verify the conclusion will definitely be of value

Keywords

integrated circuit packaging; integrated circuit reliability; life testing; soldering; surface mount technology; surface treatment; CBGA; accelerated thermal cycling; ceramic ball grid array; dog bone pads; hot air solder levelling; mechanical deflection system; pad geometry; solder joint reliability; surface finishes; Atherosclerosis; Ceramics; Electronic packaging thermal management; Electronics packaging; Geometry; Soldering; Surface finishing; Testing; Thermal stresses; Vehicles;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronics Manufacturing Technology Symposium, 1996., Nineteenth IEEE/CPMT

Conference_Location

Austin, TX

ISSN

1089-8190

Print_ISBN

0-7803-3642-9

Type

conf

DOI

10.1109/IEMT.1996.559742

Filename

559742