Optimized and microfabricated ionic wind pump array as a next generation solution for electronics cooling systems

Author

Ong, Andojo Ongkodjojo ; Abramson, Alexis R. ; Tien, Norman C.

Author_Institution

Dept. of Electr. Eng. & Comput. Sci., Case Western Reserve Univ., Cleveland, OH, USA

fYear

2012

fDate

May 30 2012-June 1 2012

Firstpage

1306

Lastpage

1311

Abstract

This work presents a microfabricated ionic wind pump array that has the potential to meet industry requirements as a next generation solution for thermal management of electronic systems. The optimized single device provides an improved COP of 26.5. The main purpose of the work presented here is to demonstrate that the optimized microfabricated ionic wind pump employed in an array provides superior cooling performance as compared to conventional CPU fans.

Keywords

cooling; microfabrication; pumps; thermal management (packaging); COP; CPU fans; coefficient of performance; electronics cooling systems; microfabricated ionic wind pump array; next generation solution; optimized single device; thermal management; Arrays; Corona; Heat pumps; Heat sinks; Heat transfer; Resistance heating; CPU fan; corona discharge; electrohydrodynamics; emerging technology; forced convection air cooling; heat transfer; optimized design; semiconductor; thermal management;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2012 13th IEEE Intersociety Conference on

Conference_Location

San Diego, CA

ISSN

1087-9870

Print_ISBN

978-1-4244-9533-7

Electronic_ISBN

1087-9870

Type

conf

DOI

10.1109/ITHERM.2012.6231571

Filename

6231571