EMC modelling of dual die CPU with a heatsink

Author

Zhu, Boyuan ; Lu, Junwei ; Li, Erping

Author_Institution

Sch. of Eng., Griffith Univ., Brisbane, QLD, Australia

fYear

2010

fDate

12-16 April 2010

Firstpage

932

Lastpage

935

Abstract

This paper presents an EMC modelling approach for the latest dual die CPU with a heatsink from an antenna point of view. The model acts as a very efficient antenna while its structure is constructed almost according to a real dual die CPU structure. Different sizes of heatsink cooperate in the investigation of electromagnetic characterization. Simulation and measurement are accomplished in far-filed range. The results show that the dual die model without heatsink is resonating at two frequencies which are 2.04 GHz and 4.9 GHz. When a heatsink is mounted however the resonant frequencies are changed to 1.80 GHz and 5.20 GHz respectively.

Keywords

data communication equipment; electromagnetic compatibility; heat sinks; EMC modelling approach; antenna; dual die CPU structure; electromagnetic characterization; far-filed range measurement; frequency 1.80 GHz; frequency 2.04 GHz; frequency 4.9 GHz; frequency 5.2 GHz; heat sink; Antenna measurements; Australia; Electromagnetic compatibility; Electromagnetic heating; Electromagnetic modeling; Heat engines; High performance computing; Packaging; Resonant frequency; Societies;

fLanguage

English

Publisher

ieee

Conference_Titel

Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on

Conference_Location

Beijing

Print_ISBN

978-1-4244-5621-5

Type

conf

DOI

10.1109/APEMC.2010.5475514

Filename

5475514