Advanced chip-in-board thin film hybrid technology with integrated polyimide film capacitors for ultra high-speed and millimeter-wave applications

Author

Nohr, Wolf-Dieter ; Hanke, Gerhard ; Weber, Dieter-Jurgen

Author_Institution

Technologiezentrum Darmstadt, Deutsche Telekom, Berlin, Germany

fYear

1998

fDate

9-12 Aug 1998

Firstpage

113

Lastpage

116

Abstract

The processing of extreme high bit rates (⩾20 Gbit/s) or signal frequencies (⩾20 GHz) is of increasing importance for advanced telecommunications. Therefore a suitable circuit arrangement is necessary. Problems like frequency dispersion of microstrip lines, frequency dependence of parasitic impedances, and transforming characteristics of any finite length of layer must be solved. For this purpose a chip-in-board embedding technique with integrated film capacitors was developed. The article describes the manufacturing of such thin film hybrid circuits containing planar capacitors and feed-through capacitors. The chip interconnection technology is represented too

Keywords

beam-lead devices; electric impedance; high-speed integrated circuits; hybrid integrated circuits; integrated circuit interconnections; integrated circuit packaging; microstrip lines; millimetre wave integrated circuits; thin film capacitors; 20 GHz; 20 Gbit/s; chip interconnection technology; chip-in-board thin film hybrid technology; circuit arrangement; feed-through capacitors; frequency dependence; frequency dispersion; high bit rates; integrated polyimide film capacitors; microstrip lines; millimeter-wave applications; parasitic impedances; planar capacitors; reverse beam-lead technology; signal frequencies; telecommunications; thin film hybrid circuits; transforming characteristics; ultra high-speed applications; Bit rate; Capacitors; Frequency dependence; Impedance; Integrated circuit technology; Manufacturing; Microstrip; Signal processing; Thin film circuits; Transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Radio and Wireless Conference, 1998. RAWCON 98. 1998 IEEE

Conference_Location

Colorado Springs, CO

Print_ISBN

0-7803-4988-1

Type

conf

DOI

10.1109/RAWCON.1998.709149

Filename

709149