• DocumentCode
    2510674
  • Title

    A novel 2.5bit SHA-less MDAC design for 10bit 100Ms pipeline ADC

  • Author

    Su, Yingping ; Ning, Ning ; Yu, Qi

  • Author_Institution
    Lab. of Mixed & Analog Circuit Design, Univ. of Electron. Sci. & Technol., Chengdu, China
  • fYear
    2011
  • fDate
    21-23 Oct. 2011
  • Firstpage
    151
  • Lastpage
    154
  • Abstract
    A sub circuit block - 2.5bit MDAC used in 10 bit 100MHz pipeline ADC fabricated in TSMC 0.35um process is presented in this paper. The pipeline ADC removes a front Sample and Hold block (SH) to save power dissipation and area. However, the aperture error between the multiplying digital-to-analog converter (MDAC) and the comparators in the sub flash may increases in large amount. It obviously decreases the precision of sample phase. In this paper, there are two ways to decrease the aperture error. Furthermore, in order to improve the accuracy of sample signal, a simplified boost-strapped switch is adopted in first 2.5bit SHA-less MDAC design, which only uses one capacitor to restore the adding voltage. The result shows that the MDAC consume 30.73 mW under 3.3v power supply. The settling time is 3ns for input signal at Nyquist rate of 50mHz.
  • Keywords
    CMOS digital integrated circuits; analogue-digital conversion; capacitors; comparators (circuits); digital-analogue conversion; integrated circuit design; multiplying circuits; pipeline processing; power aware computing; Nyquist rate; SHA-less MDAC design; TSMC process; aperture error; booststrapped switch; capacitor; comparators; multiplying digital-to-analog converter; pipelined ADC; power dissipation saving; sample and hold block; settling time; size 0.35 mum; subcircuit block; voltage 3.3 V; word length 10 bit; word length 2.5 bit; Gain; Latches; Pipelines; Signal resolution; Simulation; Switches; Transfer functions; MDAC; Pipeline ADC; SHA-less; boost-strapped switch;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computational Problem-Solving (ICCP), 2011 International Conference on
  • Conference_Location
    Chengdu
  • Print_ISBN
    978-1-4577-0602-8
  • Electronic_ISBN
    978-1-4577-0601-1
  • Type

    conf

  • DOI
    10.1109/ICCPS.2011.6092216
  • Filename
    6092216