• DocumentCode
    2511070
  • Title

    Module-level characterization for vehicle-level emissions modeling

  • Author

    Hubing, Todd H.

  • Author_Institution
    Int. Center for Automotive Res., Clemson Univ., Greenville, SC, USA
  • fYear
    2010
  • fDate
    12-16 April 2010
  • Firstpage
    680
  • Lastpage
    682
  • Abstract
    Automotive components are subjected to a variety of electromagnetic compatibility tests before they are ever installed on a vehicle, and yet the correlation between component-level EMC test results and vehicle-level EMC performance is generally poor. As automobiles become more reliant on electronic systems to ensure the reliable operation of the vehicle and the safety of its occupants, full-vehicle electromagnetic simulations are becoming an increasingly important part of the automotive design process. These simulations require accurate models for the various electronic modules found in the vehicle. CISPR 25 measurements do not yield sufficient information to be useful in full-vehicle simulations. New test procedures are required to characterize automotive modules as electromagnetic sources. Source models derived from these tests can then be used in vehicle-level electromagnetic simulations for the purpose of determining the optimum design and placement of electronic modules and wiring harnesses in the vehicle.
  • Keywords
    automotive components; automotive electronics; electromagnetic compatibility; vehicles; CISPR 25 measurement; automobile; automotive components; automotive design process; component-level EMC test; electromagnetic compatibility test; full-vehicle electromagnetic simulation; module-level characterization; vehicle-level EMC performance; vehicle-level emissions modeling; Automobiles; Automotive components; Automotive engineering; Electromagnetic compatibility; Electromagnetic measurements; Electromagnetic modeling; Electronic equipment testing; Process design; Vehicle safety; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
  • Conference_Location
    Beijing
  • Print_ISBN
    978-1-4244-5621-5
  • Type

    conf

  • DOI
    10.1109/APEMC.2010.5475540
  • Filename
    5475540