• DocumentCode
    2512707
  • Title

    Cumulative bibliography of articles on semiconductor thermal and temperature testing

  • Author

    Siegal, Bernard

  • Author_Institution
    Sage Enterprises Inc., Mountain View, CA, USA
  • fYear
    1988
  • fDate
    10-12 Feb 1988
  • Firstpage
    137
  • Lastpage
    152
  • Abstract
    The bibliography given contains both journal and conference items, from as early as 1968, but primarily from 1980 to the present. All the entries listed in the bibliography provide information on semiconductor thermal and/or temperature characteristics, measurement techniques and results, hardware applications, and other pertinent information
  • Keywords
    heat sinks; integrated circuit testing; packaging; semiconductor device testing; temperature measurement; thermal variables measurement; bibliography; semiconductor thermal characteristics; temperature characteristics; temperature testing; Bibliographies; Electronic packaging thermal management; Integrated circuit packaging; Microscopy; Plastics; Semiconductor device testing; Temperature measurement; Thermal management of electronics; Thermal stresses; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Semiconductor Thermal and Temperature Measurement Symposium, 1988. SEMI-THERM IV., Fourth Annual IEEE
  • Conference_Location
    San Diego, CA
  • Type

    conf

  • DOI
    10.1109/SEMTHE.1988.10615
  • Filename
    10615