DocumentCode
2512722
Title
TATTL: the automated thermal test lab
Author
Hayward, James D.
Author_Institution
Adv. Micro Devices, Sunnyvale, CA, USA
fYear
1988
fDate
10-12 Feb 1988
Firstpage
153
Lastpage
158
Abstract
The development of the automated thermal test lab (TATTL) at Advanced Micro Devices originated in the need to improve the efficiency and resource utilization for the thermal characterization services provided by the Materials Research Laboratory. TATTL is a set of Fortran-77 real-time data acquisition and control modules which integrate the variety of instrumentation required for the performance of device calibration and junction-to-case thermal resistance, natural-convection, and forced-convection testing. The TATTL modules provided a complete environment within which thermal testing is performed and they are built on a central database unifying the information needed during testing and subsequent reporting of results. The architecture of the TATTL system and the hardware and software used in this implementation are described. Communication with instrumentation, operation in a real-time environment, and structuring of data for efficient transfer and report generation are discussed. The software runs on a DEC QBUS system, but in this discussion, emphasis is placed on the system structure rather than the details of coding
Keywords
automatic testing; calibration; data acquisition; electronic engineering computing; semiconductor device testing; thermal variables measurement; Advanced Micro Devices; DEC QBUS; Fortran-77; TATTL; automated thermal test lab; automatic testing; control modules; device calibration; forced-convection testing; junction-to-case thermal resistance; natural-convection; real-time data acquisition; Automatic control; Automatic testing; Calibration; Data acquisition; Force control; Instruments; Laboratories; Materials testing; Resource management; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Semiconductor Thermal and Temperature Measurement Symposium, 1988. SEMI-THERM IV., Fourth Annual IEEE
Conference_Location
San Diego, CA
Type
conf
DOI
10.1109/SEMTHE.1988.10616
Filename
10616
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