A new methodology to measure electromagnetic interferences in 3G mobile platform

This paper presents a new methodology to measure electromagnetic interferences in 3G mobile platform. The main objectives of this approach are to evaluate the near field coupling between two integrated circuits, and validate, in a predictive way, that the two devices can be mounted in a same package. The methodology consists in emulating the near field electromagnetic behavior of a disruptive chip. The emulation of the aggressor device is performed by means of a specific probe. Then a risk of interference analysis is performed to validate the EMC compliance between the two chips. This analysis provides valuable information about sensitive areas, coupling orientation and critical coupling distances by means of extraction. Details of this methodology are illustrated through a 3G mobile platform. Using this approach, chip-to-chip interferences can be investigated without requiring any specific EMC test board and with a low cost near field emulator.