DocumentCode
2514194
Title
Equivalent circuit modeling of signal vias considering their return current paths
Author
Ndip, Ivan ; Ohnimus, Florian ; Löbbicke, Kai ; Tschoban, Christian ; Bierwirth, Micha ; Guttowski, Stephan ; Reichl, Herbert
Author_Institution
IZM, Fraunhofer Inst. for Reliability & Microintegration, Berlin, Germany
fYear
2010
fDate
12-16 April 2010
Firstpage
629
Lastpage
632
Abstract
A circuit model for signal vias, considering their return-current paths in five-layered stack-ups, is proposed. Closed-form expressions for the computation of via capacitance are derived and used together with conventional formulas for inductance and resistance computations to accurately account for the RF behaviour of the vias over a wide range of frequencies.
Keywords
capacitance; electric resistance; electronic engineering computing; inductance; integrated circuit modelling; RF behaviour; capacitance computation; closed form expression; equivalent circuit modeling; five-layered stack-ups; inductance computation; resistance computation; return current paths; Capacitors; Dielectric substrates; Electromagnetic interference; Electromagnetic modeling; Electromagnetic radiation; Equivalent circuits; Frequency; Integrated circuit interconnections; Microstrip; Packaging;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility (APEMC), 2010 Asia-Pacific Symposium on
Conference_Location
Beijing
Print_ISBN
978-1-4244-5621-5
Type
conf
DOI
10.1109/APEMC.2010.5475699
Filename
5475699
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