• DocumentCode
    2514633
  • Title

    Polyethylene-ceramic composites for electronic packaging applications

  • Author

    Sebastian, M.T. ; George, Sumesh ; Anjana, P.S. ; Thomas, Sherin ; Subodh, G.

  • fYear
    2008
  • fDate
    21-24 Nov. 2008
  • Firstpage
    161
  • Lastpage
    161
  • Abstract
    Summary form only given. The recent rapid progress in microwave communication accelerates the search of new materials to meet the present challenging performance requirements. In order to maintain high signal conveying efficiency, the dielectric substrate should have low relative permittivity and low dielectric loss. Several low loss low permittivity ceramics such as silicates and aluminates have been developed. However, they have high processing temperature and are brittle. Polymers are flexible having low processing temperature and exhibit excellent microwave dielectric properties. However, they have low thermal conductivity and high coefficient of thermal expansion. The composite strategy of combining the advantages of both polymer and ceramic phase can offer excellent property. Polymer ceramic composite offers excellent material characteristics such as flexibility, low processing temperature, and good microwave dielectric and thermal properties. In the present study we have taken polyethylene as the polymer because it has low processing dielectric properties. The relative permittivity of the individual phases and volume fraction of the filler are the most important factors determining the effective dielectric properties of the composites. In this paper we report the effect of ceramic fillers having relative permittivity in the range 10 to 110 (Sm2Si2O7, CeO2, Ca[(Li1/3Nb2/3)0.8Ti0.2]O3-delta, Sr2Ce2Ti5O15) in polyethylene. The effect of frequency and temperature and volume fraction of fillers in polyethylene on the dielectric properties of the composites are studied. The ceramic reinforced polyethylene composites are prepared by melt mixing and hot pressing techniques. The microstructure of the composite is studied using a scanning electron microscope. The dielectric properties at high frequency (8 GHz) are analyzed using- - the cavity perturbation method. The relative permittivity and dielectric loss increased with increase in the ceramic loading for all the ceramic polymer composites. The experimentally observed results are compared with theoretical models.
  • Keywords
    ceramic packaging; composite materials; dielectric losses; dielectric materials; microwave materials; permittivity; polymers; thermal conductivity; thermal expansion; cavity perturbation method; ceramic fillers; dielectric loss; dielectric substrate; electronic packaging; frequency 8 GHz; hot pressing technique; melt mixing; microwave communication; microwave dielectric properties; polyethylene-ceramic composites; relative permittivity; scanning electron microscope; thermal conductivity; thermal expansion coefficient; Ceramics; Dielectric losses; Dielectric materials; Dielectric substrates; Electronics packaging; Permittivity; Polyethylene; Polymers; Temperature; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Recent Advances in Microwave Theory and Applications, 2008. MICROWAVE 2008. International Conference on
  • Conference_Location
    Jaipur
  • Print_ISBN
    978-1-4244-2690-4
  • Electronic_ISBN
    978-1-4244-2691-1
  • Type

    conf

  • DOI
    10.1109/AMTA.2008.4763250
  • Filename
    4763250