Finite element analysis for solder ball failures in chip scale package

Author

Lee, Taekoo ; Lee, Jinhyuk ; Jung, Ilgyu

Author_Institution

Packaging Technol. Team, Samsung Electron. Co. Ltd., South Korea

fYear

1997

fDate

21-25 Jul 1997

Firstpage

39

Lastpage

43

Abstract

In this study, the failure mechanism of solder ball connect in chip scale packaging (CSP) utilizing wire-bonded ball grid array was elucidated using finite element analysis. The macro-micro-coupling technique was used in the current model. There exist two contributors to solder ball cracking: shear stress and warpage of the package. It was recognized that shear stress prevailed over warpage of the package in impact on solder ball cracking in the present type of CSP

Keywords

cracks; deformation; failure analysis; finite element analysis; integrated circuit packaging; integrated circuit reliability; soldering; stress-strain relations; thermal expansion; thermal stress cracking; thermal stresses; CSP; FEM; ball grid array; chip scale package; failure mechanism; finite element analysis; macro-micro-coupling technique; model; package warpage; shear stress; solder ball connect; solder ball cracking; solder ball failures; wire-bonded BGA package; Chip scale packaging; Compressive stress; Costs; Electronic packaging thermal management; Electronics packaging; Failure analysis; Fatigue; Finite element methods; Tensile stress; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical & Failure Analysis of Integrated Circuits, 1997., Proceedings of the 1997 6th International Symposium on

Print_ISBN

0-7803-3985-1

Type

conf

DOI

10.1109/IPFA.1997.638070

Filename

638070