DocumentCode
2517604
Title
Package Characterization: Simulations or Measurements?
Author
Poppe, Andrds ; Vass-Varnai, Andras ; Farkas, Gabor ; Rencz, Marta
fYear
2008
fDate
9-12 Dec. 2008
Firstpage
155
Lastpage
160
Abstract
As the functionality of thermal simulators gets more and more complex, measurement techniques also improve. Thermal engineers face and increasingly difficult task to make the right selection from the existing tools. In this paper the applicability of the JEDEC JESD 51-1 static measurement method is compared to mainstream simulation tools especially MCAD or EDA embedded CFD solutions. Both techniques are opposed to each other in terms of required time and other expense factors. In this paper we discuss when different aspects of trade-offs to be made between thermal simulation and physical testing.
Keywords
computational fluid dynamics; electronics packaging; EDA embedded CFD solutions; JEDEC JESD 51-1 static measurement; MCAD embedded CFD solutions; package characterization; thermal simulators; Computational fluid dynamics; Computational modeling; Electronic design automation and methodology; Electronic packaging thermal management; Measurement techniques; Semiconductor device packaging; Temperature; Testing; Thermal engineering; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location
Singapore
Print_ISBN
978-1-4244-2117-6
Electronic_ISBN
978-1-4244-2118-3
Type
conf
DOI
10.1109/EPTC.2008.4763427
Filename
4763427
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