DocumentCode
2520494
Title
Electromigration Reliability with Respect to Cu Content in Solder Joint System
Author
Lai, Yi-Shao ; Song, Jenn-Ming
Author_Institution
Central Labs., Adv. Semicond. Eng., Inc., Kaohsiung, Taiwan
fYear
2008
fDate
9-12 Dec. 2008
Firstpage
1160
Lastpage
1163
Abstract
Observations from assorted current stressing experiments on flip-chip solder joints imply that the Cu content in a solder joint system plays a dominant role in its electromigration reliability. In this paper, electromigration reliability of various flip-chip solder joint systems including different substrate pad finishes and solder compositions is summarized to demonstrate the effect of the Cu content. A unified failure mechanism is proposed based on morphologies observed in the current-stressed solder joints with different substrate pad finishes and different solder compositions.
Keywords
copper; electromigration; flip-chip devices; reliability; solders; Cu; assorted current stressing experiments; electromigration reliability; flip-chip solder joint systems; morphologies; substrate pad finishes; unified failure mechanism; Bonding; Current; Electromigration; Flip chip solder joints; Gold; Metallization; Packaging; Soldering; Temperature; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronics Packaging Technology Conference, 2008. EPTC 2008. 10th
Conference_Location
Singapore
Print_ISBN
978-1-4244-2117-6
Electronic_ISBN
978-1-4244-2118-3
Type
conf
DOI
10.1109/EPTC.2008.4763586
Filename
4763586
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