DocumentCode
2522878
Title
Evaluation of surface degradation of silicone rubber under natural tropical aging using thermogravimetric and thermomechanical analysis
Author
Salama ; Sirait, K.T. ; Suwarno
Author_Institution
Bandung Inst. of Technol., Indonesia
Volume
2
fYear
2000
fDate
2000
Firstpage
645
Abstract
Silicone rubber is a new insulating material for HV outdoor insulators. In order to know the long term of its performance we investigated the aging of the material under a natural tropical environment. This paper reports the investigation results on surface degradation of silicone rubber with different filler content which were installed in the open air in Bandung city, Indonesia, for 120 weeks by using thermogravimetric analysis (TGA) and thermomechanical analysis (TMA). The test results showed that adding a higher filler content improved the surface of RTV and HTV silicone rubber. The RTV with 29,2% filler content showed less surface degradation than RTV with 18% filler content; RTV with 22,9% filler content, and HTV with 72% filler content also showed less surface degradation than HTV with 48% filler content and also less surface degradation than HTV with 60% filler content. SEM photographs confirmed the results that both RTV with 29,2% filler content and HTV with 72% filler content had a little difference from those virgin samples
Keywords
environmental degradation; filled polymers; insulator testing; life testing; polymer structure; silicone rubber insulators; surface structure; thermal analysis; HTV silicone rubber; HV outdoor insulators; RTV silicone rubber; SEM; TGA; filler content; insulating material; natural tropical aging; silicone rubber; surface degradation; thermogravimetric analysis; thermomechanical analysis; Aging; Atmospheric measurements; Degradation; Plastic insulation; Polymers; Rubber; Stress; Temperature; Testing; Thermomechanical processes;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials, 2000. Proceedings of the 6th International Conference on
Conference_Location
Xi´an
Print_ISBN
0-7803-5459-1
Type
conf
DOI
10.1109/ICPADM.2000.876099
Filename
876099
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