DocumentCode
2523103
Title
Proposal of the polymer chain alignment model
Author
Andritsch, T. ; Kochetov, R. ; Morshuis, P.H.F. ; Smit, J.J.
Author_Institution
Delft Univ. of Technol., Delft, Netherlands
fYear
2011
fDate
16-19 Oct. 2011
Firstpage
624
Lastpage
627
Abstract
Four important models for explaining the properties that are observed in polymer based nanocomposites are the multi-core model, the intensity model, the interphase volume model and the double layer model. This paper outlines a new model, based on those four, which aims to explain certain properties that are considered unique to nanocomposites. The idea behind the polymer chain alignment model is that the material properties of nanocomposites strongly depend on processes prior to and during polymerization. It is assumed that a successful surface modification of nanoparticles leads to the formation of a rigid layer around each nanoparticle with properties differing from both host and filler material. The assumptions taken for the model were correlated with experimental data on epoxy based polymer nanocomposites.
Keywords
filled polymers; nanocomposites; nanoparticles; resins; double layer model; epoxy based polymer nanocomposites; epoxy resin; host and filler material; host material; intensity model; interphase volume model; material properties; multicore model; nanoparticle; polymer chain alignment model; polymerization; Dielectrics; Erbium; Nanocomposites; Permittivity; Polymers; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Insulation and Dielectric Phenomena (CEIDP), 2011 Annual Report Conference on
Conference_Location
Cancun
ISSN
0084-9162
Print_ISBN
978-1-4577-0985-2
Type
conf
DOI
10.1109/CEIDP.2011.6232734
Filename
6232734
Link To Document