• DocumentCode
    2523135
  • Title

    Enhancements of epoxy resin based syntactic foam by inner interface and matrix modifications

  • Author

    Strauchs, A. ; Schnettler, A.

  • Author_Institution
    Inst. for High Voltage Technol., RWTH Aachen Univ., Aachen, Germany
  • fYear
    2011
  • fDate
    16-19 Oct. 2011
  • Firstpage
    632
  • Lastpage
    635
  • Abstract
    The present study focuses on inner interface modifications and matrix modifications to improve the electrical and mechanical properties of epoxy resin based syntactic foam during production process and lifetime. Silane-coated hollow microspheres are used to modify the interfaces between microspheres and epoxy resin, and SiO2 nanofiller is used to modify the matrix. Electrical investigations show a positive impact of the silane-coating on the ac and dc breakdown field strength. Mechanical investigations show an increased mechanical strength of the material due to an improved adhesion quality between microspheres and epoxy resin. The nanofillers show no significant influence on the properties of the cured syntactic foam. However, it is verified that nanofillers reduce the viscosity of the uncured, liquid material. This provides a better production quality of the material at high microspheres´ filling degrees.
  • Keywords
    electric breakdown; epoxy insulation; foams; insulating coatings; matrix algebra; mechanical strength; resins; AC breakdown field strength; DC breakdown field strength; adhesion quality; epoxy resin enhancement; interface modification; liquid material; material mechanical strength; material production quality; matrix modification; nanofiller; production process; silane coated hollow microsphere; syntactic foam; Electric breakdown; Epoxy resins; Filling; Syntactics; Viscosity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation and Dielectric Phenomena (CEIDP), 2011 Annual Report Conference on
  • Conference_Location
    Cancun
  • ISSN
    0084-9162
  • Print_ISBN
    978-1-4577-0985-2
  • Type

    conf

  • DOI
    10.1109/CEIDP.2011.6232736
  • Filename
    6232736