DocumentCode
2523215
Title
Modeling dielectrophoretic force for manipulating carbon nanotubes (CNTs)
Author
Wejinya, Uchechukwu C. ; Xi, Ning ; Shen, Yantao ; Lai, King Wai Chiu
Author_Institution
Michigan State Univ. East Lansing, East Lansing
fYear
2007
fDate
4-7 Sept. 2007
Firstpage
1
Lastpage
6
Abstract
Carbon nanotubes (CNTs) are good candidates for many electronics and sensing applications. These applications will require moving (deposit) and orienting carbon nanotubes to specific location, and separating CNTs with semiconducting and metallic band structure. The use of dielectrophoresis (DEP) has been established as a course towards the efficient separation of metallic carbon nanotubes from semiconducting carbon nanotubes. It is also a method for controlled assembly of the CNTs on microstructures that have the plausibility to be scaled to wafer-level manufacturing. For this reason, in this paper, a new mathematical model for dielectrophoretic for applied to nanotubes have been developed. Simulation results are presented in the paper to verify the developed dielectrophoretic force model. The developed model can significantly improve the separation of semiconducting and metallic band structure carbon nanotubes, ultimately providing a critical and major step towards the use of carbon nanotubes in the manufacturing of electronics and sensors for potential use in electrical circuits, as fiber and film, computer circuits, light bulb filament, ultracapacitors, combat jackets, etc.
Keywords
band structure; electrophoresis; micromechanical devices; semiconductor nanotubes; carbon nanotubes; dielectrophoresis; mathematical model; metallic band structure; microstructures; modeling dielectrophoretic force; wafer-level manufacturing; Assembly; Carbon nanotubes; Circuits; Computer aided manufacturing; Dielectrophoresis; Mathematical model; Microstructure; Semiconductivity; Semiconductor device manufacture; Semiconductor device modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced intelligent mechatronics, 2007 IEEE/ASME international conference on
Conference_Location
Zurich
Print_ISBN
978-1-4244-1263-1
Electronic_ISBN
978-1-4244-1264-8
Type
conf
DOI
10.1109/AIM.2007.4412578
Filename
4412578
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