• DocumentCode
    2523215
  • Title

    Modeling dielectrophoretic force for manipulating carbon nanotubes (CNTs)

  • Author

    Wejinya, Uchechukwu C. ; Xi, Ning ; Shen, Yantao ; Lai, King Wai Chiu

  • Author_Institution
    Michigan State Univ. East Lansing, East Lansing
  • fYear
    2007
  • fDate
    4-7 Sept. 2007
  • Firstpage
    1
  • Lastpage
    6
  • Abstract
    Carbon nanotubes (CNTs) are good candidates for many electronics and sensing applications. These applications will require moving (deposit) and orienting carbon nanotubes to specific location, and separating CNTs with semiconducting and metallic band structure. The use of dielectrophoresis (DEP) has been established as a course towards the efficient separation of metallic carbon nanotubes from semiconducting carbon nanotubes. It is also a method for controlled assembly of the CNTs on microstructures that have the plausibility to be scaled to wafer-level manufacturing. For this reason, in this paper, a new mathematical model for dielectrophoretic for applied to nanotubes have been developed. Simulation results are presented in the paper to verify the developed dielectrophoretic force model. The developed model can significantly improve the separation of semiconducting and metallic band structure carbon nanotubes, ultimately providing a critical and major step towards the use of carbon nanotubes in the manufacturing of electronics and sensors for potential use in electrical circuits, as fiber and film, computer circuits, light bulb filament, ultracapacitors, combat jackets, etc.
  • Keywords
    band structure; electrophoresis; micromechanical devices; semiconductor nanotubes; carbon nanotubes; dielectrophoresis; mathematical model; metallic band structure; microstructures; modeling dielectrophoretic force; wafer-level manufacturing; Assembly; Carbon nanotubes; Circuits; Computer aided manufacturing; Dielectrophoresis; Mathematical model; Microstructure; Semiconductivity; Semiconductor device manufacture; Semiconductor device modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced intelligent mechatronics, 2007 IEEE/ASME international conference on
  • Conference_Location
    Zurich
  • Print_ISBN
    978-1-4244-1263-1
  • Electronic_ISBN
    978-1-4244-1264-8
  • Type

    conf

  • DOI
    10.1109/AIM.2007.4412578
  • Filename
    4412578