A test site thermal control system for at-speed manufacturing testing

Author

Malinoski, Mark ; Maveety, James ; Knostman, Steve ; Jones, Tom

Author_Institution

Schlumberger Test & Transactions, Westerville, OH, USA

fYear

1998

fDate

18-23 Oct 1998

Firstpage

119

Lastpage

128

Abstract

As microprocessor speeds and power increase, so too does the need for better thermal control. Today´s high performance processors generate enormous amounts of heat at the transistor level due to self heating effects within the die. Higher die temperatures reduce performance and increase failure rates. As a result, better thermal control of the microprocessors during testing has become more important. This paper reports on an analysis of this problem, and the superior thermal control obtained using direct, conductive cooling as opposed to forced convective cooling

Keywords

CMOS integrated circuits; flip-chip devices; integrated circuit testing; microprocessor chips; production testing; thermal variables control; CMOS microprocessor; calibration; data collection; die temperatures; direct conductive cooling; failure rates; flip chip package; manufacturing testing; test site thermal control; thermal control; transistor level; Control systems; Cooling; Force control; Heating; Manufacturing; Microprocessors; System testing; Temperature; Thermal conductivity; Thermal force;

fLanguage

English

Publisher

ieee

Conference_Titel

Test Conference, 1998. Proceedings., International

Conference_Location

Washington, DC

ISSN

1089-3539

Print_ISBN

0-7803-5093-6

Type

conf

DOI

10.1109/TEST.1998.743145

Filename

743145